TSMC pushes CoPoS packaging at Longtan, DigiTimes reports

TSMC is moving ahead with CoPoS, an advanced chip-packaging technology, at its Longtan site in Taoyuan, DigiTimes reported on Oct 23. Packaging is the step that joins finished chips into a single working unit.

DigiTimes gave no figures for capacity, spending or timing. TSMC has not said what the Longtan work will cost or when it will start production.

A third capacity report in five days

The report adds to other expansion news this week. On Oct 19, Chosunbiz reported that TSMC is adding a 3nm plant in Taiwan. On Oct 21, TrendForce estimated that TSMC Arizona will make more than 100 million Apple chips.

Demand is the reason TSMC itself gives for its growth. In its monthly sales report, the company said September revenue of NT$511.86 billion (about US$15.79 billion) was up 54.65% from a year earlier. It attributed the rise to greater demand for its advanced-process products. Revenue slipped 0.57% from August. Sales from January to September reached NT$3,898.73 billion (about US$120.30 billion), up 41.11% from the same months of 2025.

Shares slide through October

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The Taipei shares last closed at NT$2,385 (about US$73.59) on Oct 22, before the report. That close was 1.45% below Oct 21. From Oct 1 to Oct 22 the stock lost 4.98% in NT dollars.

The currency deepened the loss for dollar-based holders. The NT dollar weakened from 31.89 to 32.408 per US dollar over those weeks, and the stock fell 6.5% in US dollar terms.

The mood across the region was also weak on Oct 23. Bloomberg’s Asia markets video described a deepening tech selloff. SK hynix dropped plans to list its Solidigm unit in the US, Bloomberg and The Korea Herald reported.

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Information only, not investment advice.