Chips lift Korea's GDP; $63 billion backs Broadcom chips
Four smaller chip-industry stories from Oct 27: Korea's growth figures, a Broadcom financing deal, Applied Materials' BESI stake and Anthropic's IPO filing.
Chip exports pushed South Korea’s third-quarter growth well past what its central bank had expected. Across the wider industry, four lenders arranged money for Broadcom chips headed to Anthropic, Applied Materials enlarged its stake in BESI, and Anthropic’s IPO filing named TSMC among its risks.
Chip exports carry Korea past its forecast
South Korea’s real gross domestic product expanded 1% from the previous quarter in July-September. Preliminary Bank of Korea data released on Tuesday, Oct 27, showed the figure, according to The Korea Times, The Korea Herald and Yonhap. Before rounding, the rate was 0.97%, The Korea Herald reported.
The Korea Herald also said the result was more than triple the 0.3% growth the central bank had projected for the quarter in August.
Exports and investment led by semiconductors did most of the work, The Korea Herald, Yonhap and Reuters reported. Households pulled the other way. Private consumption slipped 0.2% on the quarter, the first fall since the April-June quarter of 2023, The Korea Times reported.
Trade data show the size of the chip surge. South Korea’s semiconductor export value index, with 2020 set at 100, read 733.03 in September 2026, a 268.08% rise from a year before. The KOSPI ended Oct 27 up 3.09% at 5,638.34.
A $63 billion package for Anthropic’s chips
A $63 billion financing structure to pay for AI compute capacity, meaning the processing power that AI models run on, has been set up by Citi, Morgan Stanley, Bank of America and Blackstone. The four arranged it in partnership with Broadcom. The Financial Times reported the announcement, and Reuters, Bloomberg and The Wall Street Journal also covered it.
The money is meant to pay for Broadcom chips for Anthropic, according to Reuters and Bloomberg. That makes the chip supplier a partner in funding the purchases of its own products.
Broadcom’s chief executive got personally involved to seal the Anthropic debt deal, The Wall Street Journal reported.
Applied Materials moves toward a fifth of BESI
US-listed Applied Materials is lifting its BESI stake to about 20%, Reuters and Bloomberg reported. BESI is short for BE Semiconductor. A holding of that size would give Applied Materials roughly one of every five BESI shares.
The market moved fast. BESI’s stock climbed more than 9% on Oct 27 after the stake was reported, according to Reuters.
Anthropic’s filing puts TSMC among its risks
Anthropic’s filing for an initial public offering lists disruptions at TSMC, the contract chipmaker that builds chips other companies design, among the threats to its business, Bloomberg reported.
DigiTimes reported that the document places three things at the heart of the compute risks Anthropic describes: TSMC, HBM memory and leasing compute directly. HBM, short for high-bandwidth memory, is memory stacked in layers and placed beside AI processors. A risk section of this kind lists what could hurt a company’s business; it does not say any of it has happened.
Information only, not investment advice.
Sources
- Korea's Q3 Growth Seen Near 1% as Chip Exports Surge
- Korea's economy grows 1% in Q3 on chip exports, beating forecasts
- Chip boom fails to lift spending as private consumption falls
- [COVER STORY] Chip exports drive Korea's Q3 growth to 1%, triple BOK forecast
- South Korea’s Economy Beats Forecasts on AI-Driven Chip Boom
- Breaking: South Korea's 1.0% Growth Driven by Semiconductor Surge
- South Korea Q3 GDP beats forecasts as AI chip boom boosts exports, investments
- S. Korea's GDP expands 1% in Q3 on strong exports, investment: BOK
- (2nd LD) S. Korea's GDP expands 1 pct in Q3 on strong exports, investment: BOK
- Chip boom drives Korea's surprise 1% GDP growth in Q3
- Bank of America, Blackstone, Citi and Morgan Stanley Announce Landmark $63 Billion Financing Structure to Enable AI Compute Capacity in Partnership with Broadcom – Company Announcement - FT.com
- Wall Street banks, Blackstone line up $63 billion to finance Broadcom chips for Anthropic
- Broadcom Arranges $63 Billion Deal to Finance Anthropic’s Chips
- Banks, Blackstone Form $63 Billion Financing Vehicle for Broadcom AI Tech
- Exclusive | Broadcom CEO Intervened to Seal $63 Billion Anthropic Debt Deal
- Applied Materials to raise BESI stake to about 20%
- Applied Materials Boosts BE Semiconductor Stake to About 20%
- Shares in BE Semiconductor jump over 9% after Applied Materials raises stake to 20%
- Anthropic Highlights Disruptions to TSMC Operations as a Risk
- Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk
- PHLX Semiconductor Index (SOX) closes
- KOSPI index closes
- US regular-session closes (Broadcom)
- US regular-session closes (Applied Materials)
- TWSE closing prices (TSMC)
- New Taiwan dollars per US dollar (statistic 731Y002)
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